Nanometer-level Thickness Measurement Technology for Silicon Wafers
G-TECH Insights Newsletter: 2015-12-15
This latest G-TECH Insights Newsletter looks at Lion Precision's novel methods to measure nanometer-level thickness in silicon wafers. In addition, we announce G-TECH's seminar on "High Efficiency Machining and Intelligent Monitoring Technology for Tooling Machines" at the Taichung World Trade Center on 12/24.
Nanometer-level Thickness Measurement Technology
New technology has been developed to measure silicon wafers at the nanometer level. In response to the rapid development of technology products and the continuous improvement of performance, the precision measurement of coating thickness on semiconductor wafers, hard disks and liquid-crystal screens is becoming more and more important. Today, coating thickness often needs to be whittled down to below a few microns (10^-6m) to ensure consistency.
LION PRECISION has developed a thickness measurement technique that uses a high-precision capacitive displacement sensor as follows.
- Place a standard part of known thickness between two capacitive displacement sensors
- Adjust the position of the two displacement sensors so that they are close to the center of the measurement range
- Set the two displacement sensors to a combined voltage of zero
- Replace the test piece and place it between the two displacement sensors
- Calculate the thickness of the test piece by comparing the thickness of the standard piece with the difference between the voltage totals of the standard piece and the test piece's
recommended equipment
- Two sets of Lion Precision Capacitive Displacement sensors
- Amplifiers - Two Lion CPL190
- Digital display Lion MM190
High Efficiency Machining and Intelligent Monitoring Technology for Tooling Machines Seminar- Taichung 12/24
We will hold a seminar on high-efficiency machining and intelligent monitoring technology for tooling machines at Taichung World Trade Center on December 24, 2015. The seminar will introduce Industry 4.0 and CPS technology, as well as high-efficiency machining technology for tooling machines in line with the global trends of energy saving and environmental protection. The crucial correlation between the dynamic characteristics of tooling machines and machining efficiency, as well as the application of tooling machine monitoring technology to the Internet of Things, will also be introduced. If you are interested in attending, please contact our company to register.